Huawei and Wuhan Xinxin to develop high-bandwidth memory chips amid US restrictions - report
(July 2): Huawei Technologies has teamed up with Chinese foundry Wuhan Xinxin Semiconductor Manufacturing Co to develop high-bandwidth memory (HBM) chips, according to sources, as these devices have become an indispensable component in the computing infrastructure used for artificial intelligence (AI) projects, South China Morning Post (SCMP) reported.
This also involves mainland integrated circuit (IC) packaging firms Jiangsu Changjiang Electronics Tech and Tongfu Microelectronics, which are tasked to provide the so-called Chip on Wafer on Substrate - on a single package, the sources said to SCMP.
Neither Huawei nor Wuhan Xinxin immediately replied to requests for comment on Sunday.