Infineon goes digital – Chip manufacturer invites to a virtual tour of its trade shows

Infineon Technologies AG – a world-leader in semiconductor solutions – is taking the presentation of two important trade show highlights on the internet in July, centring on power semiconductors and sensors.    

Trade shows are an essential part of communication with customers – this is where new technologies and innovative products are launched. As a result of the coronavirus, numerous trade fairs had to be cancelled or postponed since spring 2020. In the short term, Infineon Technologies AG is therefore strengthening its own activities in the digitalization of sales and marketing activities. The semiconductor manufacturer is thus presenting two important trade show highlights on the internet in July: power semiconductors and sensors.

Along with this, Infineon's virtual PCIM 2020 booth with the latest power semiconductors will be completely online as of July 1. A preview with short descriptions of the demos was made accessible yesterday (June 29). And the Virtual Sensor Experience (VSE) booth with sensor topics can be visited on the internet starting July 20. Both online experiences are similarly designed: after the registration required by data protection law, the user can explore the booth with the respective main topics on their own. At PCIM, these are industry, consumers and solutions for transport and e-mobility. At VSE, the focus is on automotive, industry and consumers, the latter once again divided into smart building and lifestyle.

Visitors to both internet trade shows have the opportunity to obtain information about products in real time via webinars: there are 17 presentations at the virtual PCIM booth, at the VSE booth up to ten. All presenters are also available for questions via a chat function afterwards. The extensive program of product presentations will run from 1 to 3 July (PCIM) and 20 to 22 July (VSE). It is therefore advisable – as with a physical trade fair – to draw up a schedule in advance.

Without any stress, the visitor can look at the product solutions for different applications over a longer period of time – and come back again and again. The respective main topic is used as a pre-selection for this: if the visitor clicks on it, the application examples with the corresponding products open up. A separate page with comprehensive information is now available for each product. This can be general descriptions, PowerPoint presentations, eLearning, infographics, videos, images (usually also as 360° view) and useful downloads.

As usual, visitors will again get a comprehensive insight into product innovations and application solutions. With the broadest portfolio of power semiconductors, including silicon, silicon carbide (CoolSiC™) and gallium nitride (CoolGaN™) technologies, Infineon continues to set standards. The online trade show will open its doors with all product information available on 1 July.

Some product highlights: As hydrogen sulfide (H2S) leads to the growth of copper-sulfide crystalline in power semiconductors, having a major impact on the lifetime of IGBT modules, to prevent premature failure, Infineon has developed H2S protection. EconoPACK+ modules with a TRENCHSTOP IGBT4 chipset are the first in the Econo portfolio to feature this new protection.

In the drivetrain of electric cars, silicon carbide stands for greater efficiency, higher power density, and performance. Infineon will give an outlook on future power modules with CoolSiC MOSFET technology. Among other things, the chipmaker will showcase the HybridPACK Drive CoolSiC and a 1200 V full bridge module for traction inverters, among others.

In addition to these highlight products, a variety of other application solutions will be on display at Infineon's virtual PCIM booth. These include for example the 2300 V PrimePACK 3+ for 1500 V central inverters in the solar sector and the 1600 A PrimePACK 2 for motors of up to 400 kW. The new TRENCHSTOP IGBT7 technology for the 650 and 1200 V voltage classes will also be presented. A special section will map the existing CoolSiC portfolio.

Ngoc Han

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